— This paper proposes an automatic tool setting method for grinding internal screw threads with non-contact proximity switch, which can be effectively applied into realistic situation with low cost ...
— The paper presents the results of contact and non-contact measurements of external profiles of selected grinding pins. The measurements were conducted in order to choose the appropriate measuring ...
— A new approach for the non-contact processing of semiconductor wafers by ultra-short-pulse electrical discharges, namely electrical discharge grinding, is developed. A prototype with a rotary cup electrode is built to investigate the new process with single …
— 2.1 Equipment and material. The experiments involving the EDM dressing of metal-bonded grinding wheel and grinding of RB-SiC ceramic were carried out on the FS420LC plane grinder, as shown in Fig. 1a. A high-frequency pulse power supply, as shown in Fig. 1b, was used to provide discharge voltage, current, and pulse width …
NCG is The Non Contact Gauge. DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below. Avoidance wafer breakage risk by the thickness measurement
— Given the outlined challenges of in-process weld inspection, non-contact ultrasonic testing proves to be favourable. LU systems generate soundwaves through the impact of photons on the test surface using pulsed laser beams and can be used to detect defects and measure the WPD in thin metal sheets [[27], [28], [29]].However, such high …
— Non-contact grinding/thinning of silicon carbide wafer by pure EDM using a rotary cup wheel electrode. Junming Guan, Yonghua Zhao. Published in Precision …
— The angles at which the centerless grinding wheels contact the part are critical to achieving the proper roundness and tolerance. ... Dopants raise the recrystallization temperature of tungsten wire and other wires, giving non-sag properties to tungsten light bulb filaments and other products. Read Content.
— The non-uniform contact behavior actually existed between bearing raceway and grinding wheel during ELID groove grinding process, the following conclusions are drawn from these studies. (1) Variety of feeding speed forms circumstance under which the interaction phenomenon takes place.
machine structure during wheel contact in the grinding and dressing processes. The user can set up the system easily, and immediately reap ... Non-Contact External/ Internal SB-5501-N SB-5511-N SB-5521-N SB-5531-N Hydro Balancer SB-5501-H SB-5511-H SB-5521-H SB-5531-H
a Corresponding author: [email protected] Contact and Non-contact Measurements of Grinding Pins Marek Magdziak 1,a, Roman Wdowik 1 1 Rzeszow University of Technology, The Faculty of Mechanical Engineering and Aeronautics, Department of Manufacturing Techniques and Automation, Poland
— The paper presents the results of contact and non-contact measurements of external profiles of selected grinding pins. The measurements were conducted in order to choose the appropriate measuring ...
DESCRIPTION. Achieving the correct wafer thickness before assembly is a key factor in semiconductor manufacturing. Wafer back grinding (or wafer thinning) is a semiconductor manufacturing process designed to control the wafer thickness, essential to produce ultra-thin wafers used to create stacked and high-density packaging in compact electronic …
The results show that non-contact ultrasonic grinding of sapphire wafer can reduce the surface roughness by 48.6% and the material removal amount was 12.9 mg. Compared with traditional contact grinding, the results show that non-contact ultrasonic grinding was better in reducing the surface roughness and improving the processing efficiency of ...
— This study develops pure electrical discharge machining as an alternative for non-contact wafer grinding and thinning to achieve high precision and low cost. This method employs a copper-made ...
— In the present paper, prediction, sensitivity analysis and adaptive control of collaborative tooth flank grinding considering both geometric accuracy and local bearing contact evaluations is developed for non-orthogonal aerospace spiral bevel gears, in order to distinguish with the conventional grinding only considering the tooth flank ...
— This study develops pure electrical discharge machining as an alternative for non-contact wafer grinding and thinning to achieve high precision and low cost. This method employs a copper-made rotary cup wheel as the tool electrode to replace the conventional diamond wheel to realize electrical discharge grinding. A prototype is built to ...
Mechanism and Experiment Study of Non-Contact Ultrasonic Assisted Grinding Weiqing Huang, Qunyou Zhong, Dawei An, Chenglong Yang, Yi Zhang; Affiliations Weiqing Huang School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, China ...
An on-line non-contact method for measuring the wear of a form grinding wheel is presented. A CCD (charge coupled device) camera with a selected optical lens and a frame grabber was used to capture the image of a grinding wheel. The analogue signals of the image were transformed into corresponding digital grey level values. Using the …
— Our proprietary EZPunch™ and EZCam™ software allows for simple Non-Round process development and is designed for machine operator use. If you have an application that might benefit from Non-Round grinding, please contact us.We will develop and demonstrate a complete grinding process specifically for your part.
— The approach demonstrated provides an automated, non-contact type method for measurement of surface roughness.
— The portable instrument considered for non-contact on-m achine measurement of the grinding pin was a high- accuracy digital 2D micrometer Keyence LS-7000, consisting on a LS-7070 measuring head ...
This paper presents the cylindrical part profile using a laser scanning micrometer (LSM) device with diameter range (0.2 to 40) mm, diameter resolution 0.05 µm, motion range axial to 300 mm. Experimental profiles measured in some detail sectional aluminum cylinder, measured profile results are equivalent measured on the industrial round gauge F135 of …
— Grind only on the face of a straight wheel. Grind only on the side of a cylinder, cup or segment wheel. Make grinding contact gently, without bumping or gouging. Never force grinding so that the motor slows noticeably or the work gets hot. The machine ampmeter can be a good indicator of correct performance.
— This paper proposes a non-contact ultrasonic grinding processing method, which can effectively avoid the phenomenon of grinding tool wear on the workpiece due …
Non-contact grinding/thinning of silicon carbide wafer by pure EDM using a rotary cup wheel electrode. Junming Guan Yonghua Zhao. Engineering, Materials Science. Precision Engineering. 2021; 9. PDF. 1 Excerpt; Save. Silicon flower structures by maskless plasma etching. Geng Zhao Xiaoyan Zhao +4 authors Yuanwei Lin. Materials Science, Physics.
— Atomic force microscopy (AFM): AFM is a high-resolution, non-contact method that uses a sharp probe to scan the wafer surface and measure its roughness. AFM provides extremely accurate …
— Owing to the non-contact property of the PLDDS and the CS, there is no additional force introduced into following measurements. ... Chatter stability of metal cutting and grinding. CIRP Annals, 53 (2) (2004), pp. 619-642. View PDF View article View in Scopus Google Scholar [8]
Non-contact grinding/thinning of silicon carbide wafer by pure EDM using a rotary cup wheel electrode Precision Engineering 10.1016/j.precisioneng.2021.12.001
